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[Data] Shirutoku Report No. 6 #Daisy Chain Sample

We respond to various inquiries from customers based on the experience and knowledge gained from previous design and evaluation.

★★Shirutoku Report: Useful Information You Can Benefit From★★ Our company is involved in the development of semiconductor package mounting technology and mounting reliability technology. We mainly focus on packages known as BGA (Ball Grid Array). In this report, we will introduce the daisy chain sample used for evaluating the mounting reliability of semiconductor packages. [Contents] ■ Daisy chain sample for identifying breakage points ■ Daisy chain sample for identifying breakage points - Case studies from customer inquiries *For more details, please refer to the PDF document or feel free to contact us.*